Microcrack testing module
SC-MC-W
Product introduction
Crack Detection Equipment SC-MC-W
Designed specifically for defect inspection of silicon wafers and cells in the photovoltaic industry, integrating multiple solutions such as TFC, NIR infrared + AI intelligent algorithms.
Flexible Multi-Solution Switching · Full-Cycle Defect Coverage
Crack Detection Equipment SC-MC-W is a high-precision automated inspection device specially developed by Vision Potential for defect detection of silicon wafers and cells in the photovoltaic industry. It innovatively integrates diverse inspection technologies such as TFC solution, TFC+visible light solution, TFC+backlight crack solution, bright-field backlight crack solution, dark-field backlight crack solution, combining NIR infrared imaging technology with AI intelligent algorithms to achieve full-cycle defect coverage from silicon material slicing to cell manufacturing processes. Multiple solutions can be switched on demand, adapting to multi-technology route cell products and different inspection scenarios, balancing production efficiency and inspection accuracy.
SC-MC-W Device Diagram350×250×600mm | Approx. 20kg
Applications
01
Silicon Material Slicing Manufacturing
Outgoing quality inspection and in-process inspection for mono/polycrystalline silicon wafers and quasi-mono slices after ingot cutting, accurately identifying defects such as cracks, broken pieces, silicon dropout, edge chipping, ensuring incoming material quality.
02
Cell Manufacturing · Incoming Inspection
Incoming quality inspection for purchased silicon wafers and semi-finished cells, preventing unqualified materials from entering the production process and stabilizing production line operation.
03
Cell Manufacturing · In-Process Inspection
Covers the entire process including texturing, diffusion, coating, etching, metallization, etc., adopting dark-field inspection solutions to effectively avoid issues like unclear imaging and interference common in traditional methods, real-time monitoring of process damage.
04
University/Laboratory Research & Testing
Supports customizable inspection parameters and flexible switching between multiple solutions, providing high-precision imaging data for research on PV material defect mechanisms and new algorithm validation.
Functions
A
Module Structure
Composed of four parts: camera module, light source module, machined structural parts, and computing module, ensuring stability and reliability.
B
Full Size Compatibility
Supports 156×156mm~210×210mm (half/full wafers) without changing adapter components.
C
High-Speed Batch Inspection
Throughput ≥6000 pieces/hour, inspection time 0.25~0.5s, matching production line rhythm.
D
Core Defect Recognition
Accurate detection of typical defects such as cracks, edge chipping, corner breaks, fragments, silicon dropout.
E
Flexible Solution Switching
One-click switching between bright-field/dark-field crack solutions and TFC series solutions, adapting to different materials/thicknesses.
F
Multi-Technology Route Compatibility
Compatible with mainstream and emerging cell technologies such as PERC/TOPCon/HJT/xBC.
G
Automation Integration
Online/offline machines seamlessly integrate with production lines, realizing fully automated inspection, sorting, and alarming processes.
H
Defect Traceability
AI algorithm automatically records defect location/type/size, generates inspection data for process traceability.
I
High-Precision Data Output
Imaging accuracy ≥0.1mm/pixel, multiple solutions capture minute defect details.
J
Flexible Parameter Adjustment
Core parameters such as exposure time, defect size/length/grayscale support manual customization.
K
Multi-Dimensional Analysis Support
Imaging data can be exported, compatible with third-party analysis software, meeting production statistics or academic research needs.
Technical Advantages
①
Solution Adaptability · Full Scene Coverage
- Multi-solution fast switching: one-click switch between bright-field/dark-field crack solutions and TFC series solutions, no extra debugging required
- Solves the pain point of uneven imaging caused by diverse incoming material line directions in traditional equipment
- Multi-technology route compatibility: PERC/TOPCon/HJT/xBC, poly/mono/quasi-mono wafers, and pre/post coating processes
- Seamless full-process integration: dedicated solutions for incoming, texturing, coating, diffusion, etching, metallization, etc.
②
Inspection Efficiency · Intelligent & Efficient
- High-speed batch inspection: throughput ≥6000 pieces/hour, inspection time 0.25~0.5s
- Full core defect coverage: cracks, edge chipping, corner breaks, fragments, silicon dropout, notches, scratches, no omission
- Automated integration and traceability: seamless connection with production lines, AI automatically records defect location/type/size, generates inspection reports
③
Precision Accuracy · High-Definition Imaging
- Ultra-high imaging accuracy: 1k/4k resolution cameras, ≥0.1mm/pixel, 900~1700nm wavelength dedicated for crystalline silicon
- Accurate defect detection: 50μm crack width recognition, effectively avoiding false detections caused by process fluctuations and surface contamination
④
Software & Hardware Support · Stable Adaptation
- Flexible hardware compatibility: full size coverage 156~210mm, custom stage, durable materials
- Adjustable software parameters: manual customization of exposure time (10μs~1s), wavelength, focus distance (400-650mm)
- Convenient data interaction: imaging data exportable, compatible with third-party software, standard Windows AI inspection software
Technical Specifications
Parameter Specification Model SC-MC-W Camera Specifications NIR enhanced InGaAs camera / 4K line scan CMOS, 1k/4k pixels, exposure 10μs~10s, response 900-1700nm Infrared Pixels 1024*1 pixels / 4096*2 pixels Lens Specifications HD wide-angle 16/25/45mm optional, FOV ≥80°, telephoto lens optional Light Source Specifications Semiconductor laser, wavelength 1100±5nm / 1300±5nm / 1450±5nm Spot Uniformity ≥90% (within effective detection area) Exposure Cycle 20μs~10000μs, step 1ms adjustable Detection Wavelength Range 900~1700nm (for crystalline silicon) Compatible Sizes 156×156mm ~ 210×210mm (half/full wafers) Wafer Thickness 160~200μm Inspection Objects Crystalline silicon cells (PERC/TOPCon/HJT/xBC); pre-coating / pre-process cells Detectable Defect Types Cracks, edge chipping, silicon dropout, notches, corner breaks, fragments, scratches, etc. Stage Size Adaptable to automated tracks (customizable) Control Method Proprietary host software fully automated control Detection Accuracy Crack width > 50μm detectable Imaging Accuracy ≥0.1mm/pixel Focus Mode / Distance Manual focus / 400-650mm Hardware Mount Aluminum profile, sheet metal, etc. Inspection Time 0.25s~2s (based on automation cycle) Test Platform Windows + standard AI inspection software Power 500-1000W Power Supply Protection Reverse current/overload/leakage/ESD/overheat protection Computing Device Industrial computer Ambient Temperature 15-50℃, Humidity 30%-70% (non-condensing) Equipment Weight Approx. 20kg (actual product prevails) Dimensions 350×250×600mm (L×W×H) Power Supply Single-phase AC220V±10%, 50HZ±1HZ Application Examples
Poly TFC Crack
Poly TFC Crack Detail
Mono TFC Crack Detail
Mono Wafer TFC Crack
Poly Wafer TFC Crack
Bright Field Crack
Bright Field Crack
Bright Field Si Dropout
Bright Field Notch + Crack
Bright Field Edge Chipping
Dark Field Si Dropout
Dark Field Perforation
Dark Field Crack
Dark Field Si Dropout
Dark Field Edge Chipping
Core Positioning
A high-precision automated inspection device specially developed for defect detection of silicon wafers and cells in the photovoltaic industry. It innovatively integrates diverse inspection technologies such as TFC solution, TFC+visible light solution, TFC+backlight crack solution, bright-field backlight crack solution, dark-field backlight crack solution, combining NIR infrared imaging technology with AI intelligent algorithms to achieve full-cycle defect coverage from silicon material slicing to cell manufacturing processes. Multiple solutions can be switched on demand, adapting to multi-technology route cell products and different inspection scenarios, balancing production efficiency and inspection accuracy, providing users with flexible and efficient customized inspection solutions.
Silicon Wafers · Cells · Full-Process Crack Control
Flexible Multi-Solution Switching · NIR+AI Precision Recognition · Throughput ≥6000 pcs/hr
TFC/Bright Field/Dark Field SwitchableCracks/Edge Chipping/Si Dropout Full Coverage
Applications
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