Square Ingot Microcrack Testing Equipment

SC-MC-BI

Product introduction
Square Bar Crack Detection Equipment SC-MC-BI

Used for targeted removal of cracks and stress, avoiding batch breakage, optimizing silicon bar transfer process to reduce breakage rate.

Vision Potential · Square Bar Crack Detection

Square Bar Crack Detection Equipment SC-MC-BI is used for targeted removal of cracks and stress, avoiding batch breakage. It analyzes the distribution patterns of crack and stress locations, optimizes the silicon bar transfer process, and reduces breakage rate. It can be combined with square bar dimension inspection for integrated square bar testing.

Device image 1

Device image 2

Device image 3

Application Scenarios

01

Silicon Rod Factory QC (Outgoing Inspection)

Inspect finished square bars for cracks and stress to ensure outgoing quality.

02

Wafer Factory IQC (Incoming Inspection)

Re-inspect incoming square bars to eliminate cracks and stress issues, preventing breakage during slicing.

Functions

①

Detect Cracks and Stress in Square Bars

Accurately locate defects to avoid slicing waste.

②

Combinable with Square Bar Dimension Inspection

Achieve integrated square bar testing with data sharing.

③

Data Upload

Interface with MES for production traceability.

④

Customizable Inspection Solutions

Adjust detection parameters according to customer requirements.

Technical Advantages

A

Square Bar Stress Detection

Provides stress distribution in square bars, offering an efficient and reliable means for anomaly analysis.

B

High-Sensitivity Infrared Camera

Equipped with a high-sensitivity infrared camera, compatible with both N-type and P-type bars, and adaptable to a wide range of resistivity square bars.

Technical Parameters
- Model
- SC-MC-BI
- Infrared Camera
- 1k line scan
- Detectable Types
- Crack, diameter, length, stress, twin crystal, dislocation detection, etc.
- Crack Detection
- Positioning accuracy ±1mm, cracks with length ≥1mm can be detected
- Marking Specification
- Mark according to stress (compatible with traditional marking rules)
- Test Platform
- Windows
- Power Consumption
- 800W
- Input Voltage
- AC 220V
- Computer
- DELL
- Monitor
- 2K monitor
- Data Storage
- 100,000 images
- Inspection Object
- Square bar
- Weight
- 300kg
- Operating Temperature
- -30℃~80℃
- Relative Humidity
- ≤85%RH
Application Cases

Crack Example 1

Crack Example 2

Stress Distribution Map

Overall Crack Detection Image

Core Value

Accurate detection of cracks and stress in square bars prevents wafer breakage, optimizes processes, and reduces production costs. It can be integrated with dimension inspection, uploads data to MES, supporting smart manufacturing.

Square Bar Crack & Stress Detection · Prevent Breakage

Crack/Stress/Dislocation/Twin Crystal · Positioning Accuracy ±1mm

High-sensitivity IR N/P Type Compatible

Applications


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势创智能 Nanjing Vision Potential Intelligent Technology Co.,Ltd.Established based on the Nanjing Xiangning Artificial Intelligence Research Institute, we have brought together a number of outstanding industry...