Silicon Ingot Testing Equipment
SC-Ingot-LR
Product introduction
Rough Ingot Inspection Equipment SC-Ingot-LR
Mainly used for inspecting long rough ingots, including cracks, diameter, length, stress, twins, dislocations, etc. Can be combined with a marking machine for fully automatic marking.
Vision Potential · Rough Ingot Inspector
Rough Ingot Inspector SC-Ingot-LR is mainly used for inspecting long rough ingots, including detection of cracks, diameter, length, stress, twins, dislocations, etc. The equipment can be combined with a marking machine to achieve fully automatic rough ingot marking, enabling complete automation from crystal pulling to cutting. It replaces traditional manual measurement and marking, greatly saving labor and improving accuracy, avoiding material waste caused by reverse cutting of the ingot tail.
Device image 1
Device image 2
Device image 3Application Scenarios
01
Ingot Marking · Precise Cutting
Replaces traditional manual measurement and marking using steel rulers or tape measures, greatly saving labor and improving marking accuracy, avoiding material waste caused by reverse cutting of the ingot tail. The equipment can automatically mark and interface with MES to upload marking positions.
02
Fully Automatic AGV Integration
Fast inspection, automatic docking with AGV, no manual handling required, achieving full process automation from crystal pulling to cutting machine.
Functions
①
Automated Ingot Marking
Complete all inspection items in one go, automatically draw physical lines.
②
Comprehensive Inspection
Detects stress, cracks, dislocations, twins, crystal line, diameter, length.
③
Accurate Tail Cutting
Accurately cut off the tail, avoiding undercutting (multiple re-cuts) or overcutting (material waste).
④
Automatic Marking
Draw physical lines on the ingot, interface with MES to upload marking positions.
⑤
Fast Inspection
Automatically dock with AGV, no manual handling, improving efficiency.
Technical Advantages
A
Non-Contact Measurement · Backlight Profilometry
Uses backlight profilometry, unaffected by silicon rod surface reflection and ambient temperature, no need for frequent exposure adjustments, stable detection, service life up to 10 years. Overcomes the disadvantages of traditional 3D measurement methods such as short laser life and susceptibility to interference.
B
Unique Stress Detection Algorithm
Through internal characteristic detection, it can distinguish between high-stress and low-stress areas, independent of surface dislocation lines and crystal line fracture positions. Accurately determine the cutting position based on the stress map, ensuring the rod does not crack after cutting, superior to traditional marking specifications.
C
Non-Contact Resistivity Analysis
Can reflect resistivity distribution through images without contacting the rough ingot, providing additional material characteristic data.
Technical Parameters
Parameter Specification Model SC-Ingot-LR Infrared Camera 1k line scan Dimension Camera 4K Detectable Types Crack, diameter, length, stress, twin, dislocation detection, etc. Diameter Detection Range 200-350mm Length Detection Range 500-7500mm Diameter Detection Accuracy ±0.5mm Length Detection Accuracy ±0.5mm Diameter Data Display Max, min values (all diameter data of the rod can be output) Crack Detection Positioning accuracy ±1mm, cracks with length ≥1mm can be detected Marking Specification Mark according to stress (compatible with traditional marking rules) Test Platform Windows Power Consumption 800W Input Voltage AC 220V Computer DELL Monitor 2K monitor Data Storage 100,000 images Inspection Object Rough ingot to be cut Weight 1000kg Operating Temperature -30℃~80℃ Relative Humidity ≤85%RH Application Cases
Marking Display
Defect Display
Data Sharing
Stress Analysis
Stress Analysis
Stress Analysis
Stress Analysis
Core Value
The rough ingot inspection machine makes ingot cutting more precise, saving factories a large amount of human resources and reducing waste of ingot tail material. Through non-contact measurement, unique stress algorithms, and non-contact resistivity analysis, it achieves efficient, stable, and accurate fully automatic rough ingot inspection and marking, supporting the intelligentization of the entire photovoltaic silicon ingot processing workflow.
Rough Ingot Inspection · Automatic Marking · Precise Cutting
Backlight Profilometry · Accurate Stress Identification · Non-Contact Resistivity
Crack/Stress/Dislocation/Twin Diameter/Length/Crystal Line/Marking
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